POLYMER, FILM-FORMING COMPOSITION, INSULATING FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING THE POLYMER

摘要

PROBLEM TO BE SOLVED: To provide a film-forming composition comprises a polymer which can form an insulating film hard to be damaged even by an etching step, the insulating film, a semiconductor device provided with the insulating film, and a method for producing the polymer.

SOLUTION: The film-forming composition comprises a polymer with a dispersion ratio of 1.0 to 2.5 obtained by polymerizing a polymerizable compound containing a compound having a partial structure, in the molecule, including an adamantane type cage structure and a polymerizable reactive group contributing to polymerization reaction.

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