Disclosed are various features associated with a securing mechanism for a wafer bonder. In certain situations, operation of securing mechanisms can generate undesirable particles and debris, and some them can be introduced to a wafer being bonded. In certain implementations, a securing mechanism can be configured to reduce the likelihood of such particles and debris being introduced to the wafer.
申请公布号
WO2012047810(A2)
申请公布日期
2012.04.12
申请号
WO2011US54632
申请日期
2011.10.03
申请人
SKYWORKS SOLUTIONS, INC.;CANALE, STEVE;ZAPP, DAVID, J.