发明名称 BOARD ASSEMBLY STRUCTURE
摘要 A board assembly structure includes a case (11) that includes an open portion, and inside of which a plurality of protracting terminals (20) are provided, a board (21) that includes conductive through-holes into which the protruding terminals (20) fit, a support portion (19a, 19b) that is provided on a bottom surface of the case (11) and supports the board, and a guide mechanism (17a, 17b, 18a, 18b) that includes an inclined surface and is provided on an inside surface of the case (11). The guide mechanism (17a, 17b, 18a, 18b) guides the board (21) that has been inserted into the case (11) through the open portion of the case (11), such that the conductive through-holes engage with the protruding terminals (20), and then stops guiding the board (21) before the board (21) becomes supported by the support portion (19a, 19b).
申请公布号 WO2011145003(A3) 申请公布日期 2012.04.12
申请号 WO2011IB01468 申请日期 2011.05.20
申请人 TOYOTA JIDOSHA KABUSHIKI KAISHA;INOSE, TAKASHI;YAMAMOTO, SHINICHI 发明人 INOSE, TAKASHI;YAMAMOTO, SHINICHI
分类号 H05K7/14;H05K5/00 主分类号 H05K7/14
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