| 摘要 |
SPUTTERING CATHODE HAVING A NON-BONDED SEMICONDUCTING TARGET 5OF THE DISCLOSURE A sputtering cathode is generally provided. The sputtering cathode can include a semiconducting target (e.g., a cadmium sulfide target, a cadmium tin oxide target, etc.) defining a sputtering surface and a back surface opposite to the sputtering surface. A backing plate can be positioned facing the back surface of the target and non-bonded to the back 0 surface of the target. A non-bonding attachment mechanism can removably hold the target within the sputtering cathode such that the back surface is facing the backing plate during sputtering. 2,3,45 -- -12 - 12 - 12 2,3,45 12 44FIG -1 55 46 38// - 12 ,18 17//.0 52 FIG -2 16 -3 |
