| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is capable of being manufactured in low cost, has excellent heat cycle characteristics, and includes a plate electrode corresponding to a plurality of chips. <P>SOLUTION: A semiconductor device of the present invention comprises a plurality of semiconductor chips 5 formed on a substrate, and a plate electrode 1 connecting between electrodes of the plurality of semiconductor chips 5. The plate electrode 1 has half-cut portions 1a formed by half blanking, and the salient sides of the half-cut portions 1a are bonded to the electrodes of the semiconductor chips. <P>COPYRIGHT: (C)2012,JPO&INPIT |
