| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve adhesion between a resist pattern and a substrate before forming a pattern for rewiring while ensuring detachability of the resist pattern after forming the pattern for the rewiring. <P>SOLUTION: A surface modification layer 16 for improving adhesion between a metal film 5 and a resist film 6 is formed on a surface of the metal film 5 formed on a semiconductor chip. Rewiring 7a to 7c are formed on the metal film 5 via the surface modification layer 16. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012074406(A) |
申请公布日期 |
2012.04.12 |
| 申请号 |
JP20100212184 |
申请日期 |
2010.09.22 |
| 申请人 |
TOSHIBA CORP |
发明人 |
UDA TATSUO;EZAWA HIROKAZU;YAMASHITA SOICHI;NAGAMINE KIMIRO;MIYATA MASAHIRO;SHIOTSUKI TATSUO;MURANISHI KIYOSHI |
| 分类号 |
H01L23/12;H01L21/3205;H01L23/52 |
主分类号 |
H01L23/12 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
