发明名称 PLASMA PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To allow a user to easily replace only a surface portion of a stage electrode of a plasma processing apparatus when the surface is damaged. <P>SOLUTION: A stage electrode 20 is divided into an electrode body 21 and an electrode plate 22. A peripheral end face 21e of the electrode body 21 and a peripheral end face 22e of the electrode plate 22 are flush with each other. A plurality of frame members 30 are arranged along the outer periphery of the stage electrode 20. The frame members 30 are advanced/retracted between an advanced position and a retracted position by an advancing/retracting mechanism 5. When the frame members 30 are positioned at the advanced position, positioning faces 33 of the frame members 30 are brought into contact with the peripheral end faces 21e and 22e so that the electrode plate 22 is positioned. Further, a workpiece 9 is positioned by steps 31 of the frame members 30. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012074193(A) 申请公布日期 2012.04.12
申请号 JP20100217047 申请日期 2010.09.28
申请人 SEKISUI CHEM CO LTD 发明人 MIYAZATO KENICHIRO;SAITO NAOMICHI;NAKANO YOSHINORI
分类号 H05H1/24;C23C16/458;C23C16/50;H01L21/304;H01L21/3065 主分类号 H05H1/24
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