| 摘要 |
<P>PROBLEM TO BE SOLVED: To make the diameter of vias smaller than that of conventional vias without sacrifice of connection reliability because the connection area of via interface increases, and to obtain a printed wiring board or a build-up wiring board of higher density. <P>SOLUTION: In the multilayer printed wiring board, a plurality of wiring layers are formed on an insulating substrate with an insulation layer interposed therebetween, and the wiring layers are interconnected electrically by field vias. A groove or a hole is formed in the surface of a land of the wiring layer in order to form a hole for via in the insulation layer at a position corresponding to the land of the wiring layer, and a field via is formed in the hole for via thus interconnecting the wiring layers electrically. <P>COPYRIGHT: (C)2012,JPO&INPIT |
