RESIN COMPOSITION, CURED RESIN PRODUCT, WIRING BOARD, AND MANUFACTURING METHOD FOR WIRING BOARD

摘要

By producing a resin composition containing (A) an epoxy resin having at least two epoxy groups per molecule and including a hexanediol structure, (B) a UV active ester-containing compound, and (C) an epoxy resin hardening accelerator, an insulating resin layer can be easily adhered to a wiring conductor with high strength, even when the irregularities in the surface of the insulating resin layer are small.