摘要 |
<p>Provided is a metal base circuit board that makes it possible to suppress abrasion of a metal substrate due to a white resist layer even if metal base circuit boards are managed by being stacked by product management. A metal base circuit board (1) is provided with: a circuit section (7) that is provided on a metal substrate (3) with an insulating layer (5) therebetween; and a white resist layer (9), which contains an inorganic filler, and which covers the insulating layer (5) and the circuit section (7) on the metal substrate (3) by forming LED soldering lands (9a, 9b, 9c) on the circuit section (7). The metal base circuit board is characterized in that a dummy circuit (11) is formed between the white resist layer (9) and the insulating layer (5) on the metal substrate (3) side, said dummy circuit maintaining a height at a position spaced apart from the circuit section (7), and that a symbol pattern (13) constituting the substrate topmost portion is formed of a symbol ink on the surface of the white resist layer (9) having the height thereof maintained by means of the dummy circuit (11).</p> |
申请人 |
NHK SPRING CO., LTD.;SASAKI, HITOSHI;YUKIMASA, TARO;NAGAOKA, EIKI;OHIGASHI, YASUNOBU |
发明人 |
SASAKI, HITOSHI;YUKIMASA, TARO;NAGAOKA, EIKI;OHIGASHI, YASUNOBU |