| 摘要 |
A coupling mechanism for coupling together a first body and a second body of an electronic device includes a first engagement module and a second engagement module. The first engagement module is disposed at the first body and has an engagement groove and a first guiding slope connected thereto. The second engagement module is disposed in a receiving space of the second body and includes an engaging member and a resilient element. The engaging member has a pressing portion and an engaging portion. The pressing portion protrudes from the second body so as to be pressed. The engaging portion is slidable relative to the first guiding slope to thereby lift/lower the engaging member, and is engageable with the engagement groove to couple the first and second bodies together. The resilient element exerts a resilient force upon the engaging member according to the lifted/lowered state of the engaging member.
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