| 摘要 |
<p>A chemical mechanical polishing (CMP) composition comprising a specific heteropolyacid Abstract A chemical-mechanical polishing (CMP) composition comprising: (A) inorganic particles, organic particles, or a mixture thereof, (B) a heteropolyacid of the formula HaXbPsMOyVzOc wherein X = any cation other than H 8<y<18 8<z<14 56<c<105 a+b = 2c-6y-5(3+z) b>0 and a > 0 (formula I) or a salt thereof, and, (C) an aqueous medium.</p> |
| 申请人 |
BASF SE;SCHMITT, CHRISTINE;KARPOV, ANDREY;ROSOWSKI, FRANK;BRANDS, MARIO;LI, YUZHUO;BASF (CHINA) COMPANY LIMITED |
发明人 |
SCHMITT, CHRISTINE;KARPOV, ANDREY;ROSOWSKI, FRANK;BRANDS, MARIO;LI, YUZHUO |
