发明名称 MOLDING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a molding apparatus that prevents a molding material from leaking out of a cavity and eliminates the need for a gasket. <P>SOLUTION: The cavity 6 formed in a mold has, at its peripheral end, a thin-wall molding part 4 smaller in thickness than its inside part. A main heater to heat the molding material 8 with which the inside part of the cavity 6 is filled, and a thin-wall molding part heater which is provided in the opposite parts 20 and 21 of the thin-wall molding part 4 in the mold, and heats the molding material 8 flowing in the thin-wall molding part 4, are equipped separately. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012071426(A) 申请公布日期 2012.04.12
申请号 JP20100216174 申请日期 2010.09.27
申请人 PANASONIC CORP 发明人 ISHIKURA KENTARO
分类号 B29C33/02;B29C39/26;B29C45/73 主分类号 B29C33/02
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