| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a photosensitive resin composition enabling formation of a pattern with excellent mechanical characteristics. <P>SOLUTION: The photosensitive resin composition contains the following components (A), (B), (C), (D) and (E). They are: (A) a resin; (B) a polymerizable compound; (C) a polymerization initiator; (D) a compound having two or more of at least one kind of group selected from the group consisting of active methylene groups and active methine groups, and having a molecular weight of less than 3000; and (E) a solvent. An acetoacetyl group is preferable as the at least one kind of group selected from the group consisting of active methylene groups and active methine groups. <P>COPYRIGHT: (C)2012,JPO&INPIT |
