| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the following problems: in the method of surface mounting a connector and a printed wiring board, a mechanical stress generated when a connector is inserted or pulled out is applied to a solder joint; and warpage of the printed wiring board due to heat during reflow of the connector and the printed wiring board possibly causes a poor solder joint. <P>SOLUTION: In the connection of a printed wiring board and a connector, surface-mount lead pins and press-fit pins exist mixedly so that solder joint by surface-mount lead is used at a part where it is required to address high-speed signals and high frequencies, and press-fit pins are used at a part where it is not required to address high-speed signals and high frequencies like power supply pins. <P>COPYRIGHT: (C)2012,JPO&INPIT |
