| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a pattern forming technology for forming a prescribed pattern on a substrate by applying an application liquid containing a pattern forming material from a nozzle relatively moved to the surface of the substrate, wherein the pattern stable in the pattern width and in an end part position is formed. <P>SOLUTION: In applying the application liquid onto the substrate and forming a line-like pattern, discharging of the application liquid is initiated from an inward position X0 which is inward from an originally intended start position X1, while keeping the amount of the gap between a nozzle and the substrate to a smaller value G0 than the height of the pattern. Following this, the nozzle moves toward the outside of the substrate while moving away from the substrate, and reverses its movement direction at the pattern start position X1. Near a posterior end as well, the nozzle moves closer to the substrate while reducing the discharged quantity of the application liquid, and the movement direction is reversed while moving the nozzle away at a pattern end position X3. <P>COPYRIGHT: (C)2012,JPO&INPIT |
