发明名称 |
Diced Wafer Adaptor and a Method for Transferring a Diced Wafer |
摘要 |
A diced wafer adaptor that includes: a cylindrical shaped inner portion, adapted to support and hold an annular frame and a membrane suspended within the annular frame and to apply vacuum to an outer portion of the membrane; wherein an inner portion of the membrane supports a diced wafer and is surrounded by the outer portion of the membrane; and an outer portion having a perimeter shaped substantially as a perimeter of a non-diced wafer. |
申请公布号 |
US2012087774(A1) |
申请公布日期 |
2012.04.12 |
申请号 |
US20070161698 |
申请日期 |
2007.01.25 |
申请人 |
VEKSTEIN URI;NISSANY ITZIK;CAMTEK LTD |
发明人 |
VEKSTEIN URI;NISSANY ITZIK |
分类号 |
B23P17/04;B25B11/00;H01L21/68 |
主分类号 |
B23P17/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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