| 摘要 |
<p>Disclosed is an electronic component packaging sheet comprising a surface conductive layer formed on the surface of at least one side of a substrate sheet. The substrate sheet comprises: (A) 80,000-220,000 Mw of a styrene-conjugated diene block copolymer; (B) 200,000-400,000 Mw of a polystyrene resin; and (C) 150,000-210,000 Mw of an impact resistant polystyrene resin. The surface conductive layer comprises: (D) an acrylic copolymer resin; and (E) carbon nanotubes. The electronic component packaging sheet is a transparent conductive sheet having excellent thermoforming properties, good transparency after thermoforming, and sufficient electrostatic diffusion performance to maintain a low surface resistance value. The electronic component packaging sheet is particularly suited for the manufacture of embossed carrier tape.</p> |
