INTERPOSERS, ELECTRONIC MODULES, AND METHODS FOR FORMING THE SAME
摘要
<p>In various embodiments, an electronic module features a first cavity in a first side of a substrate, a fill hole extending from the first cavity, and a second cavity in a second side of the substrate. The second cavity is in fluidic communication with the fill hole, and a die is encapsulated within the second cavity.</p>
申请公布号
WO2012048095(A2)
申请公布日期
2012.04.12
申请号
WO2011US55077
申请日期
2011.10.06
申请人
THE CHARLES STARK DRAPER LABORATORY, INC.;THOMPSON, JEFFREY, C.;RACZ, LIVIA, M.;TEPOLT, GARY, B.;LANGDO, THOMAS, A.;MUELLER, ANDREW, J.
