| 摘要 |
<p>PURPOSE: A method for manufacturing a semiconductor chip package is provided to eliminate a void in a semiconductor chip by dually supplying an underfill resin to a central part of the semiconductor chip. CONSTITUTION: A semiconductor chip(130) is prepared. A plurality of bumps is formed on the one side of the semiconductor chip. The semiconductor chip is mounted on a substrate(110). An underfill resin(120) is supplied to a central part of the semiconductor chip by using a nozzle between the semiconductor chip and the substrate. The semiconductor chip and the substrate, to which the underfill resin is provided, are cured. A cured semiconductor package is molded.</p> |
