| 发明名称 |
SIGNAL TRANSMISSION DEVICE |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To realize temperature compensation of a light emitting element through a simple structure without increasing the size of the device. <P>SOLUTION: An element driving IC 20 has a reference voltage generation part 41 generating a voltage B according to a predetermined voltage A and a temperature and a temperature compensation part 42 controlling a bias current Ibias and a modulation current Imod according to the temperature. The temperature compensation part 42 performs current control according to the temperature by reproducing temperature current characteristics of a light emitting element 11 based on the voltages A and B applied by the reference voltage generation part 41 through a straight line representing the temperature current characteristics and having the slope changed from a negative value to a positive value at a change point. <P>COPYRIGHT: (C)2012,JPO&INPIT |
| 申请公布号 |
JP2012074793(A) |
申请公布日期 |
2012.04.12 |
| 申请号 |
JP20100216423 |
申请日期 |
2010.09.28 |
| 申请人 |
YAZAKI CORP;PHI MICROTECH INC |
发明人 |
NOGUCHI KENGO;AKAZAWA YUKIO;YAMAGATA CHIEMI;NAKADA ATSUSHI |
| 分类号 |
H04B10/40;H04B10/50;H04B10/564;H04B10/60 |
主分类号 |
H04B10/40 |
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