发明名称 MILLIMETER DEVICES ON AN INTEGRATED CIRCUIT
摘要 An integrated circuit (IC) device arrangement includes a substrate, an IC die coupled to the substrate, an antenna coupled to the IC die, and a first wirelessly enabled functional block coupled to the IC die. The wirelessly enabled functional block is configured to wirelessly communicate with a second wirelessly enabled functional block coupled to the substrate. The antenna is configured to communicate with another antenna coupled to another device.
申请公布号 US2012086114(A1) 申请公布日期 2012.04.12
申请号 US201113022291 申请日期 2011.02.07
申请人 BROADCOM CORPORATION 发明人 ZHAO SAM ZIQUN;ROFOUGARAN AHMADREZA;BEHZAD ARYA;CASTANEDA JESUS;BOERS MICHAEL
分类号 H01L23/48;H01L21/60 主分类号 H01L23/48
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