发明名称 |
CERAMIC SUBSTRATE, SUBSTRATE FOR POWER MODULE, AND MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a ceramic substrate of a substrate for a power module, a substrate for a power module having this ceramic substrate, and a manufacturing method of the substrate for the power module capable of uniformly bonding a ceramic substrate formed of an aluminum nitride and a metal layer in a short time. <P>SOLUTION: A infrared absorption layer 22 having a higher infrared absorptivity than an infrared transparency aluminum nitride layer 21 is laminated between a plurality of infrared transparency aluminum nitride layers 21 to form a ceramic substrate 2. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012074610(A) |
申请公布日期 |
2012.04.12 |
申请号 |
JP20100219567 |
申请日期 |
2010.09.29 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
AOKI SHINSUKE;NAGASE TOSHIYUKI |
分类号 |
H01L23/36;H01L23/13 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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