发明名称 CERAMIC SUBSTRATE, SUBSTRATE FOR POWER MODULE, AND MANUFACTURING METHOD OF SUBSTRATE FOR POWER MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a ceramic substrate of a substrate for a power module, a substrate for a power module having this ceramic substrate, and a manufacturing method of the substrate for the power module capable of uniformly bonding a ceramic substrate formed of an aluminum nitride and a metal layer in a short time. <P>SOLUTION: A infrared absorption layer 22 having a higher infrared absorptivity than an infrared transparency aluminum nitride layer 21 is laminated between a plurality of infrared transparency aluminum nitride layers 21 to form a ceramic substrate 2. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012074610(A) 申请公布日期 2012.04.12
申请号 JP20100219567 申请日期 2010.09.29
申请人 MITSUBISHI MATERIALS CORP 发明人 AOKI SHINSUKE;NAGASE TOSHIYUKI
分类号 H01L23/36;H01L23/13 主分类号 H01L23/36
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