| 摘要 |
The invention provides a clamper for testing semiconductor chip, a test device, a test method and a method for producing semiconductor device. Positions of adsorption holes on the clamper for testing are respectively designed according to varieties of load bearing belts with different designs. The clamper for testing (10) presses the load bearing belt with device zone and non-device zone against to the detector for executing characteristic examine of the semiconductor chip, and the device zone and the non-device zone are formed into a banding shape, and the device zone is repeatedly equipped with a semiconductor chip and a zone of conductor pattern which is electrically connected with the semiconductor chip on the moving direction, and the non-device zone is equipped on the side of the device zone, multiple sprocket holes are arranged on the moving direction, and the clamper for testing is equipped with a pressing surface (20) of pressing load bearing belt, and the pressing surface (20) is equipped with a peristome (22) with adsorption holes (21) of adsorption load bearing belt on the shared section relative zone (FCA) which is opposite to the non-device zone and the zone without sprocket holes.
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