| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light emitting device which improves adhesion between a compact and a lead, and to provide a method for manufacturing the light emitting device and a package array for the light emitting device. <P>SOLUTION: In a light emitting divice 100, a first lead 40 has a first leg 101. The first leg 101 continues into an outer surface of a compact 30 (a rear surface 20D of a package 20) and a first rear surface 41B of a first connection part 41. <P>COPYRIGHT: (C)2012,JPO&INPIT |
