| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a light-emitting device housing package capable of improving extraction efficiency of light from a light-emitting device without long-term deterioration. <P>SOLUTION: A light-emitting device housing package includes: a ceramic substrate on which a light-emitting device is mounted; and a wiring pattern formed on the ceramic substrate and electrically connected to the light-emitting device chip. And a white thin film layer made up of a sinter body of white inorganic particles is formed on at least the upper surface of the wiring pattern other than a connection region between the wiring pattern and the light-emitting device chip. <P>COPYRIGHT: (C)2012,JPO&INPIT |
