| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multi-layer wiring substrate with an SVH (Surface Viahole) that can be applied to a high-frequency wave and can be made high in density and that can reduce man hours, by ensuring the filling property of through holes with adhesive resin in the case that a pair of wiring substrates each having through holes are adhered with each other using the adhesive resin to configure the multi-layer wiring substrate with an SVH. <P>SOLUTION: A multi-layer wiring substrate with an SVH is formed by adhering a pair of wiring substrates having plural layers of wiring patterns provided via insulation layers and a through hole penetrating the insulation layers and the wiring patterns by using adhesive resin. Adhesion surfaces on which the pair of wiring substrates are adhered with each other by using the adhesive resin, have no signal circuit. <P>COPYRIGHT: (C)2012,JPO&INPIT |
