发明名称 GLUE SUPPLY DEVICE AND GLUE SUPPLY METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide a glue supply device and a glue supply method, capable of suppressing the decomposition and corrosion of glue and enabling sufficient use of the effect of the glue. <P>SOLUTION: The glue supply device 2 for supplying a glue solution 230 to electrolyte 10 inside an electrolyzer 11 for electrolytically refining copper includes: a dissolution tank 23 for dissolving the glue 20; a feeder 22 for supplying the glue into the dissolution tank 23; a liquid level measuring device 27 for measuring the liquid level height of the glue solution 230 stored inside the dissolution tank 23; and a controller 30 for measuring the liquid level height of the glue solution 230 in the dissolution tank 23 by the liquid level measuring device and controlling the feeder mechanism 223 and valve 250 of the feeder 22 so as to replenish the glue and water in an amount required for the glue solution 230. A small amount of the glue solution is prepared and also continuously supplied to the electrolyte 10. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012072458(A) 申请公布日期 2012.04.12
申请号 JP20100218639 申请日期 2010.09.29
申请人 PAN PACIFIC COPPER CO LTD 发明人 TSUCHIE YASUHIRO;WAKAYAMA MASAHIRO;WADA TATSUYA;KAWAGUCHI KENICHI
分类号 C25C7/06 主分类号 C25C7/06
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