发明名称 PACKAGING APPARATUS FOR ELECTRIC CIRCUIT BOARD UNIT
摘要 <P>PROBLEM TO BE SOLVED: To provide a packaging apparatus that is configured to pack an electric circuit board unit having a construction in which a mounting flange formed in a protective case is attached to a prescribed place by screws and the like in a state in which the electric circuit board unit has been removed from the packaging apparatus, and that enables the electric circuit board unit to be housed and held in a housing chamber partitioned in a package box, in a housed posture not causing damage to the mounting flange, and that enables the electric circuit board unit to be housed in a housed state in which a side wall of the housing chamber is not damaged by the mounting flange, and that enables the electric circuit board unit in the housing chamber to be housed in a stable state and also in a housed state in which breakage or the like of the packaging box is not caused. <P>SOLUTION: The packaging apparatus for the electric circuit board unit includes: the electric circuit board unit 1 in which a printed wiring board mounted with an electric circuit component is housed in a protective case made of synthetic resin; and the packaging box made of a corrugated board in which the plurality of partitioned housing chambers 6 are formed. In the packaging apparatus, the electric circuit board unit has the mounting flange 4 protruded to the outside, and insertion grooves 12 in which the mounting flange is to be inserted are formed in the housing chamber in a direction in which the electric circuit board unit is inserted into the housing chamber. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012071877(A) 申请公布日期 2012.04.12
申请号 JP20100219445 申请日期 2010.09.29
申请人 SANYO ELECTRIC CO LTD;TEGA SANYO INDUSTRY CO LTD 发明人 KOBAYASHI ATSUSHI
分类号 B65D77/26;B65D81/113;B65D85/86 主分类号 B65D77/26
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