| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an alignment apparatus, a substrate processing apparatus and an alignment method capable of aligning attitude of a work well. <P>SOLUTION: After a noted mark 94a moves from an initial position P0 to a first measurement position P1 by a first distance D1, a position calculation part calculates the first measurement position P1 of the noted mark 94a in a coordinate system of a first captured image based on the first captured image captured by a corresponding capturing part. Further, after the noted mark 94a moves from the first measurement position P1 to a second measurement position P2, the position calculation part calculates the second measurement position P2 in a coordinate system of a second captured image based on the second captured image captured by the corresponding capturing part. Subsequently, based on the calculated first and second measurement positions P1 and P2, and a first angle θ1, a mark position of the noted mark 94a viewed from a rotational axis 35a is calculated. Then, an inclination of a substrate with respect to a main scanning direction is obtained by obtaining a straight line passing through the obtained mark position of each alignment mark. <P>COPYRIGHT: (C)2012,JPO&INPIT |
