| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board and a manufacturing method of a mounting structure thereof capable of satisfying requirements of electrical reliability improvement. <P>SOLUTION: A manufacturing method of a wiring board according to an embodiment comprises: a step of forming, on a ground layer 13, a plurality of electrolytic plating layers 14 which are separated from each other in a planar view and include a first layer 15a formed on the ground layer 13 using a DC electrolytic plating method, a second layer 15b formed on the first layer 15a using a reverse electrolytic plating method, and a third layer 15c which is formed on the second layer 15b using the DC electrolytic plating method and serves as the outermost layer; a step of etching a part of the ground layer 13 disposed between the electrolytic plating layers 14 in the planar view; a step of forming an insulation layer 10 on the third layer 15c; a step of forming a through hole P in the insulation layer 10 so as to expose a part of the third layer 15c on the bottom of the through hole P; and a step of forming a sputtered layer 16 on the inner wall surface and the bottom of the through hole P. <P>COPYRIGHT: (C)2012,JPO&INPIT |
