| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polyimide film that achieves both low linear expansion and chemical resistance by compensating deterioration of chemical resistance caused by low linear expansion. <P>SOLUTION: The polyimide film is obtained by performing imidization of a dope solution which is obtained by mixing an imidization catalyst comprising a tertiary amine, a dehydrating agent comprising an acid anhydride, and an aromatic compound having specific structure with a polyamic acid obtained by the reaction of an aromatic diamine with an aromatic acid dianhydride in an organic solvent. The polyimide film has good chemical resistance, for example, deformation of the film after immersed in acetone at 23°C for 1 minute is 3 mm or less. The polyimide film is suitably used in glass alternative applications because of the good chemical resistance. <P>COPYRIGHT: (C)2012,JPO&INPIT |
