发明名称 |
METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND FOR PROCESSING SUBSTRATE, AND SUBSTRATE PROCESSING APPARATUS |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device that manufactures a film having a good uniformity between batches in the concentration and the growth rate of a doped element. <P>SOLUTION: The method comprises a step for processing a product substrate; a step for performing at least one or more cycles including supplying inactive gas to a reactor and exhausting gas from the reactor in a condition that the product substrate after process, is housed, to change a pressure in the reactor and perform a first purge in the reactor; and a step for performing at least one or more cycles including supplying the inactive gas to the reactor and exhausting gas from the reactor in a condition that the product substrate after process, is removed from the reactor, to change a pressure in the reactor and perform a second purge in the reactor. A pressure change amount in the reactor during the second purge is set larger than that during the first purge. <P>COPYRIGHT: (C)2012,JPO&INPIT |
申请公布号 |
JP2012074737(A) |
申请公布日期 |
2012.04.12 |
申请号 |
JP20110285460 |
申请日期 |
2011.12.27 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC |
发明人 |
NODA TAKAAKI;SUZAKI KENICHI |
分类号 |
H01L21/205;C23C16/24;C23C16/44 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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