发明名称 Vertical Semiconductor Device with Thinned Substrate
摘要 A vertical semiconductor device (e.g. a vertical power device, an IGBT device, a vertical bipolar transistor, a UMOS device or a GTO thyristor) is formed with an active semiconductor region, within which a plurality of semiconductor structures have been fabricated to form an active device, and below which at least a portion of a substrate material has been removed to isolate the active device, to expose at least one of the semiconductor structures for bottom side electrical connection and to enhance thermal dissipation. At least one of the semiconductor structures is preferably contacted by an electrode at the bottom side of the active semiconductor region.
申请公布号 US2012086045(A1) 申请公布日期 2012.04.12
申请号 US201113270335 申请日期 2011.10.11
申请人 MOLIN STUART B.;STUBER MICHAEL A.;IO SEMICONDUCTOR, INC. 发明人 MOLIN STUART B.;STUBER MICHAEL A.
分类号 H01L27/04;H01L27/12;H01L29/732;H01L29/739;H01L29/744;H01L29/78 主分类号 H01L27/04
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