APPARATUS AND METHOD FOR TEMPERATURE CONTROL DURING POLISHING
摘要
Embodiments of the present invention relate to apparatus and method for improve uniformity of a polishing process. Embodiments of the present invention provide a heating mechanism configured to apply thermal energy to a perimeter of a substrate during polishing, or a cooling mechanism configured to cool a central region of the substrate during polishing, or a biased heating mechanism configured to create a temperature step differential on a given radius of a polishing pad.
申请公布号
WO2012021215(A3)
申请公布日期
2012.04.12
申请号
WO2011US40630
申请日期
2011.06.16
申请人
APPLIED MATERIALS, INC.;CHEN, HUNG CHIH;HSU, SAMUEL CHU-CHIANG;DANDAVATE, GAUTAM SHASHANK;KOOSAU, DENIS M.
发明人
CHEN, HUNG CHIH;HSU, SAMUEL CHU-CHIANG;DANDAVATE, GAUTAM SHASHANK;KOOSAU, DENIS M.