| 摘要 |
A chip stacked structure is provided. The chip stacked structure includes a first die and a second die stacked on the first die. The first die has a plurality of connection structures each which has a through hole, a connection pad and a solder bump. The connection pad has a terminal connected to the through hole. The solder bump is disposed on the connection pad and located around the through hole. The second die has a plurality of through holes which are aligned and bonded to the solder bump respectively. The chip stacked structure may simplify the process and improve the process yield rate. |
