发明名称 COOLING APPARATUS FOR INJECTION MOLD AND INJECTION MOLD HAVING THE SAME
摘要 PURPOSE: An injection mold and a cooling device of an injection mold are provided to enhance cooling effect by evaporative latent heat on phase changes since liquid in a chamber boils, bubble is generated and the chamber is kept wet. CONSTITUTION: A cooling device(20) comprises a chamber(30), a liquid supply unit(40), and a vacuum pump(50). The liquid supply unit is communicated with one side of the chamber and supplies liquid to the chamber. The vacuum pump reduces the inside of the chamber. The vacuum pump is communicated with the other side of the chamber. The vacuum pump emits steam generated when liquid in the chamber boils.
申请公布号 KR20120034398(A) 申请公布日期 2012.04.12
申请号 KR20100095941 申请日期 2010.10.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LEE, GOON PYO;JANG, DONG SEOB;LEE, YOUNG SOO;SUH, JAE IN;LEE, RAI YOUNG;KIM, DAE JUNG;JUNG, JIN HO;JUNG, DONG SOO
分类号 B29C45/73;B29C45/77;B29C45/78 主分类号 B29C45/73
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