METHOD OF MANUFACTURING ELECTRONIC DEVICES ON BOTH SIDES OF A CARRIER SUBSTRATE AND ELECTRONIC DEVICES THEREOF

摘要

In some embodiments, a method of manufacturing at least one first electronic device and at least one second electronic device. The method can include: providing a carrier substrate having a first side and a second side, a first substrate bonded to the first side of the carrier substrate, and a second substrate bonded to the second side of the carrier substrate; depositing at least one layer of a first material over the first substrate while the first substrate is bonded to the first side of the carrier substrate to create a portion of the at least one first electronic device; and depositing at least one layer of a second material over the second substrate while the second substrate is bonded to the second side of the carrier substrate to create a portion of the at least one second electronic device. In many embodiments, at least one of the first substrate or the second substrate can be a flexible substrate. Other embodiments are disclosed.