BONDING BASE FOR ELECTRONIC COMPONENTS, AND METHOD

摘要

A bonding base for electronic components, and a method. The bonding base comprises: a dielectric basic layer formed of a mixture comprising thermoplastic polymer, the polymer part of which mixture comprises 75 to 95% by weight of thermoplastic PPO, the polymer part further comprising 5 to 20% by weight of elastomer which is incompatible with PPO.