| 摘要 |
A Light Emitting Diode (LED) encapsulation process (fig. 3) and a shield structure 20 made thereby comprising first encapsulation layer 30, phosphor powder 40 uniformly disposed on a surface of first encapsulation layer 30 and second encapsulation layer 31 disposed on phosphor powder 40 and covering first encapsulation layer 30 so that phosphor powder 40 is sandwiched between the two encapsulation layers 30, 31 wherein heating and stamping is then performed using moulds (50, 51, fig. 4e) to form one piece which is cut to form LED shield 20. LED shield 20 may form a lens of different shapes e.g. circular arc-shaped shield 20. First and second encapsulation layers 30, 31 may be formed by coating liquid silicone on a model and curing to form thin film-type layers. Second encapsulation layer 31 may be formed by coating liquid silicone on the surface of first encapsulation layer 30 with phosphor powder 40. An outer side surface of shield 20 can be pressed annularly using an embossed mould (50, fig. 5d) to form a reflecting structure (21, fig. 5e) for guiding a direction and angle of light projection. First and second encapsulation layers 30, 31 may also be thermally compressed together. |
