| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a polishing speed improver and a water soluble polishing/grinding agent including the polishing speed improver, capable of being favorably used for polishing/grinding a silicon wafer, a ceramic, a metal, a glass and the like and attaining high polishing speed and an excellent re-dispersion effect of further deposited abrasive. Ž<P>SOLUTION: This polishing speed improver consists of polyacrylamide derivative, preferably homopolymer of N, N-dimethylzinc acrylamide, or copolymer of N, N-dimethylzinc acrylamide with acrylic (acid) as active ingredient. Besides, cationic water soluble macromolecular, preferably polyethyleneimine are also included in the polishing speed improver. Ž<P>COPYRIGHT: (C)2008,JPO&INPIT Ž</p> |
