Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for a chemical mechanical polishing process, and process for producing semiconductor devices,申请号EP20060119461-传众专利搜索

发明名称	Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion for a chemical mechanical polishing process, and process for producing semiconductor devices
摘要
申请公布号	EP1757665(B8)	申请公布日期	2012.04.11
申请号	EP20060119461	申请日期	2006.08.24
申请人	JSR CORPORATION	发明人	SHIDA, HIROTAKA;TAKEMURA, AKIHIRO;HATTORI, MASAYUKI;MINAMIHABA, GAKU;FUKUSHIMA, DAI;KURASHIMA, NOBUYUKI;YAMAMOTO, SUSUMU;TATEYAMA, YOSHIKUNI;YANO, HIROYUKI
分类号	C09G1/02;B24B37/04;H01L21/321;H01L21/768	主分类号	C09G1/02
代理机构		代理人
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