INTERPOSER, PROBE CARD AND METHOD FOR MANUFACTURING INTERPOSER

摘要

Disclosed is an interposer comprising a silicon substrate (20). A plurality of conductive holes (27) penetrating the silicon substrate (20) are formed by dry etching, and at least one end of each conductive hole (27) is provided with a probe (12) via a pad (45). Since conductive holes are formed in a substrate that can be processed by dry etching, a plurality of microscopic conductive holes can be continuously formed and a probe can be connected to each conductive hole. Consequently, there can be obtained an interposer wherein probes are arranged at high density.