| 摘要 |
<P>PROBLEM TO BE SOLVED: To mount a component on a substrate by measuring and detecting the amount of unevenness of a printed board with a substrate height measuring means, and automatically controlling the mounting height of the component by a mounting head according to the amount of unevenness. <P>SOLUTION: A first or second component mounting portion integrally includes the substrate height measuring means for measuring the height of substrate. The means has a substrate height teaching operation mode for measuring and storing substrate height by the substrate height measuring means at a timing of first carrying-in of a printed substrate or a desired arbitrary timing, and a mounting operation mode for deciding a component mounting stroke based on the measurement data acquired by the substrate height measuring means and the teaching data. <P>COPYRIGHT: (C)2009,JPO&INPIT |
