| 摘要 |
The precut (20) is formed directly during the molding of the substrate (12). An independent claim is included for a smart card made as described. Preferred features: The precut is a groove surrounding the inner part of the substrate, where its thickness is reduced. It is a slit (20) interrupted by bridging sections (22, 24, 26). A starting point for tearing (28) is formed when molding the substrate. On at least one edge of the mini card as defined by the slit, there is a chamfer (32) formed during molding. Pressure injection molding is employed to make the mini card. One bridging section (26) has significant width, injection taking place close to it. Injection takes place at one edge, the main direction of injection being contained in the plane of the substrate and directed towards the bridging section (26). The electronic microcircuit forms part of a module which is carried in a cavity made in the card substrate, this cavity being formed during molding of the substrate. |
