发明名称 |
Acoustic wave device and method for manufacturing the same |
摘要 |
An acoustic wave device includes: a piezoelectric substrate on which an acoustic wave element and an electrode pad connected to the acoustic wave element are formed; a first resin part having a first opening located above a function area in which an acoustic wave is excited by the acoustic wave element and a second opening located above the electrode pad; a second resin part that covers the first opening and has a third opening located above the second opening; and a metal layer formed on the electrode pad in the second opening, the first opening and the second opening being inversely tapered. |
申请公布号 |
US8154170(B2) |
申请公布日期 |
2012.04.10 |
申请号 |
US20090546188 |
申请日期 |
2009.08.24 |
申请人 |
KIMURA MASANORI;AIKAWA SHUNICHI;TSUDA KEJI;OSHITA HIKOMASA;TAIYO YUDEN CO., LTD. |
发明人 |
KIMURA MASANORI;AIKAWA SHUNICHI;TSUDA KEJI;OSHITA HIKOMASA |
分类号 |
H01L41/047;H03H9/25 |
主分类号 |
H01L41/047 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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