| 摘要 |
The invention relates to a process for manufacturing a composite substrate comprising bonding a first substrate onto a second semiconducting substrate, characterized in that the process includes, before bonding, the formation of a bonding layer between the first and the second substrate, the bonding layer comprising a plurality of islands distributed over a surface of the first substrate in a determined pattern and separated from one another by regions of a different type, which are distributed in a complementary pattern, wherein the islands are formed via a plasma treatment of the material of the first substrate.
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