发明名称 Bonding apparatus and method
摘要 A bonding apparatus and method holds first and second bodies peripherally, one above the other, on respective shelves. A lower heat-transfer body is configured to lift the first body from below and press the first and second bodies against an upper heat-transfer body to enable bonding between the first and second bodies.
申请公布号 US8151852(B2) 申请公布日期 2012.04.10
申请号 US20090495114 申请日期 2009.06.30
申请人 ZUNIGA STEVEN M.;TOLLES ROBERT D.;AQUI DEREK G.;NAGENGAST ANDREW J.;SENN ANTHONY J.;GUERRERO KEENAN LEON;TWIN CREEKS TECHNOLOGIES, INC. 发明人 ZUNIGA STEVEN M.;TOLLES ROBERT D.;AQUI DEREK G.;NAGENGAST ANDREW J.;SENN ANTHONY J.;GUERRERO KEENAN LEON
分类号 B32B37/00 主分类号 B32B37/00
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