发明名称 |
Multilayer ceramic electronic component including external electrodes that include a plating layer having a low film stress |
摘要 |
A multilayer ceramic electronic component includes a laminate including a stack of a plurality of ceramic layers and a plurality of internal electrodes extending along interfaces between the ceramic layers, and a plurality of external electrodes electrically connecting the internal electrodes exposed at surfaces of the laminate. Each external electrode includes a plating layer at least at the portion directly connected to the internal electrodes. The plating layer has a compressive film stress of about 100 MPa or less or a tensile film stress of about 100 MPa or less. |
申请公布号 |
US8154848(B2) |
申请公布日期 |
2012.04.10 |
申请号 |
US20090354026 |
申请日期 |
2009.01.15 |
申请人 |
MOTOKI AKIHIRO;OGAWA MAKOTO;TAKEUCHI SHUNSUKE;KAWASAKI KENICHI;MURATA MANUFACTURING CO., LTD. |
发明人 |
MOTOKI AKIHIRO;OGAWA MAKOTO;TAKEUCHI SHUNSUKE;KAWASAKI KENICHI |
分类号 |
H01G4/228;H01G4/06 |
主分类号 |
H01G4/228 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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