THREE DIMENSIONAL STACKED SEMICONDUCTOR INTEGRATED CIRCUIT

摘要

PURPOSE: A 3D laminated semiconductor integrated circuit is provided to reduce the number of TSVs(Through Silicon Via) by transmitting a pulse type signal from a master slice to a slave slice. CONSTITUTION: A 3D laminated semiconductor integrated circuit includes a master slice(110) and a plurality of slave slices(200). A plurality of slave slices share a plurality of TSVs for transmitting an operation control signal from the master slice to the plurality of slave slices. The operation control signal is a signal for controlling an active/precharge operation of the plurality of slave slices. The master slice transmits the operation control signal with the pulse type.